Authors :
Jayasekar Micheal
Volume/Issue :
Volume 8 - 2023, Issue 9 - September
Google Scholar :
https://bit.ly/3TmGbDi
Scribd :
https://tinyurl.com/vrt25p49
DOI :
https://doi.org/10.5281/zenodo.8397973
Abstract :
Printed Circuit Boards (PCBs) Stackup is the
arrangement of different layers to make up a PCB and it
involves determining the number of layers, their order,
and the materials used for each layer. The Stackup design
plays an important role in the PCB design, as it directly
impacts the performance, signal integrity, durability,
reducing the electromagnetic emissions, and overall
functionality of the electronic device. It is core related to
the PCB Material and lamination process based on layer
count, prepreg/Core material, thickness of each layer's,
copper weight, via type, drilling type, layers ordering,
and high-speed impedance control requirements. As
modern AI/AR electronic products become more compact
and complex, careful consideration of the PCB stackup
becomes even more critical. In this article, we explore the
key factors and strategies for optimizing PCB stackup to
achieve enhanced signal integrity and performance.
Keywords :
PCB Laminations, Copper Weight, Signal Layers, Lamination Materials, Power Plane, Strip Line, Micro-Strip Line, Impedance Control, EMI, EMC, Single Ply-Dual Ply, DK, TG, and CTE.
Printed Circuit Boards (PCBs) Stackup is the
arrangement of different layers to make up a PCB and it
involves determining the number of layers, their order,
and the materials used for each layer. The Stackup design
plays an important role in the PCB design, as it directly
impacts the performance, signal integrity, durability,
reducing the electromagnetic emissions, and overall
functionality of the electronic device. It is core related to
the PCB Material and lamination process based on layer
count, prepreg/Core material, thickness of each layer's,
copper weight, via type, drilling type, layers ordering,
and high-speed impedance control requirements. As
modern AI/AR electronic products become more compact
and complex, careful consideration of the PCB stackup
becomes even more critical. In this article, we explore the
key factors and strategies for optimizing PCB stackup to
achieve enhanced signal integrity and performance.
Keywords :
PCB Laminations, Copper Weight, Signal Layers, Lamination Materials, Power Plane, Strip Line, Micro-Strip Line, Impedance Control, EMI, EMC, Single Ply-Dual Ply, DK, TG, and CTE.
