Authors :
Jayasekar Micheal; M. Amalanathan
Volume/Issue :
Volume 8 - 2023, Issue 6 - June
Google Scholar :
https://bit.ly/3TmGbDi
Scribd :
https://tinyurl.com/57rfkw3r
DOI :
https://doi.org/10.5281/zenodo.8208176
Abstract :
Printed Circuit Boards (PCBs) have become
integral to modern electronics. With the increasing
demand for high-speed digital/Analog/RF Circuits, the
need for PCBs with high-speed materials has grown
significantly. High-speed materials have become
necessary for PCBs in commercial, data centers,
telecommunication, and aerospace applications. This
article will discuss the basics of the high-speed materials
selection process, its properties, the Lamination process,
and the materials used in PCBs. PCBs are an essential
component of electronic devices, and performance and
reliability depend on the materials used in their
construction. The PCB material selection process involves
comprehensively understanding various materials and
their properties. This article will explore the steps
involved in the PCB material selection process.
Keywords :
PCB Fabrication, PCB lamination Process, Glass fabric, Flex PCB, Glass Weave Skew, Single Ply-Dual Ply, Dielectric Constant (dk), Coefficient of Thermal Expansion (CTE).
Printed Circuit Boards (PCBs) have become
integral to modern electronics. With the increasing
demand for high-speed digital/Analog/RF Circuits, the
need for PCBs with high-speed materials has grown
significantly. High-speed materials have become
necessary for PCBs in commercial, data centers,
telecommunication, and aerospace applications. This
article will discuss the basics of the high-speed materials
selection process, its properties, the Lamination process,
and the materials used in PCBs. PCBs are an essential
component of electronic devices, and performance and
reliability depend on the materials used in their
construction. The PCB material selection process involves
comprehensively understanding various materials and
their properties. This article will explore the steps
involved in the PCB material selection process.
Keywords :
PCB Fabrication, PCB lamination Process, Glass fabric, Flex PCB, Glass Weave Skew, Single Ply-Dual Ply, Dielectric Constant (dk), Coefficient of Thermal Expansion (CTE).
