Authors :
Jayasekar Micheal
Volume/Issue :
Volume 9 - 2024, Issue 2 - February
Google Scholar :
http://tinyurl.com/22wfws86
Scribd :
http://tinyurl.com/2s3h789v
DOI :
https://doi.org/10.5281/zenodo.10656132
Abstract :
Printed Circuit Boards (PCBs) Via is the
arrangement of different layers to make up a PCB. It
involves determining the number of layers, their order,
and the materials used for each layer. PCB Via is a plated
hole in a circuit board that connects different layers of
the board, allowing electrical signals and power to pass
between them. They serve as electrical connections
between different circuit board layers and help in
efficiently routing signals and power. This article
provides an in-depth understanding of PCB vias,
discussing their types, design considerations, advanced
Via technologies, and best practices.
Keywords :
PCB Vias, Blind Via, Buried Via, Microvia, Sequential Laminations, Aspect Ratio, Via Filling, Via Plating, Annular Ring, Stackup.
Printed Circuit Boards (PCBs) Via is the
arrangement of different layers to make up a PCB. It
involves determining the number of layers, their order,
and the materials used for each layer. PCB Via is a plated
hole in a circuit board that connects different layers of
the board, allowing electrical signals and power to pass
between them. They serve as electrical connections
between different circuit board layers and help in
efficiently routing signals and power. This article
provides an in-depth understanding of PCB vias,
discussing their types, design considerations, advanced
Via technologies, and best practices.
Keywords :
PCB Vias, Blind Via, Buried Via, Microvia, Sequential Laminations, Aspect Ratio, Via Filling, Via Plating, Annular Ring, Stackup.
