Authors : Rahul Kumar

Volume/Issue : Volume 10 - 2025, Issue 12 - December

Google Scholar : https://tinyurl.com/bdfaurna

Scribd : https://tinyurl.com/yc597zsf

DOI : https://doi.org/10.38124/ijisrt/25dec1121

Note : A published paper may take 4-5 working days from the publication date to appear in PlumX Metrics, Semantic Scholar, and ResearchGate.

Abstract : Zinc oxide (ZnO), triallyl isocyanate (TAIC), and zinc acylate form a complementary stabilizer–co-agent system that enhances the reliability of EVA and POE photovoltaic (PV) encapsulants under heat, moisture, and UV stress. ZnO provides broad-band UV absorption (UV-A/UV-B) and functions as an acid scavenger—neutralizing acetic acid generated by EVA hydrolysis—thereby mitigating silver grid/ribbon corrosion and preserving optical clarity when used in surface-modified (e.g., silane-treated) nanoparticulate form. TAIC acts as a multifunctional peroxide co-agent, increasing crosslink density and enabling lower peroxide levels, which reduces browning risk and improves dimensional stability. Zinc acylate contributes ionic/covalent interactions at interfaces, improving adhesion to glass/backsheet and promoting cure uniformity across film thickness. We outline the synergistic mechanism: ZnO stabilizes the matrix (UV protection + acid scavenging), TAIC builds tri-functional bridges that raise gel content, and zinc acylate enhances interfacial bonding— collectively delivering superior UV resistance, adhesion retention, and potential-induced degradation (PID) resilience. Comparative guidance for EVA vs POE (cure kinetics, lamination windows, moisture barrier, and electrical insulation) is provided, along with practical formulation ranges for ZnO/TAIC/zinc acylate packages and notes on dispersion and transparency control. A visual IEC 61215 test matrix (Damp Heat, UV preconditioning, Thermal Cycling, Humidity Freeze, PID) and illustrative performance charts (UV transmittance vs ZnO loading, gel content vs lamination time, corrosion index vs ZnO loading) demonstrate typical trends and trade-offs. This integrated approach helps module manufacturers balance throughput and long-term reliability, enabling publish-ready documentation and data-driven optimization of encapsulant systems for modern PV architectures.

References :

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